Product Highlights

Indium Corporation manufactures bar solder to surpass the strict quality demands of the surface mount industry, providing more consistent, reliable performance.

Solid solder wire from Indium Corporation is manufactured to meet demanding quality standards of ASTM B-32, J-STD-006, and JIS-Z-3282.

The CW-807 is compatible with all Indium Corporation no-clean solder pastes, wave fluxes, and common soft solder alloys.

Indium bar solder chips are small pieces of electronics-grade bar solder used to fill smaller pots or to quicken the melting of solder in a new solder pot.

The Indium6.6HF water-soluble solder paste from Indium is capable of SnPb and Pb-free assembly processes with an exceptional reflow process window.

Indium CW-219 highly activated, high-performance, no-clean cored wire is ideal for robotic and hand soldering of very oxidized surfaces.

Indium technologically advanced flux pens each contain 10 ml of flux and feature exceptional leak control and dispensing capability.

Indium CW-818 cored wire features heat-resistant and low-spatter properties, providing an assembly with excellent visual appearance.

Indium Corporation Indium8.9HF solder paste features high transfer efficiency through small apertures (≤0.66 AR) and provides high oxidation resistance.

Indium CW-807RS high-reliability no-clean formula cored wire comes in a highly active, effective activator package with spatter control and heat resistance.

Indium CW-301 water-soluble cored wire is optimized for use with Sn/Pb and Pb-free assembly and rework processes.

Indium Solder Fortification® Preforms are generally rectangle- or disc-shaped pieces of alloyed metal that do not contain any flux.