Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 1.76 oz (50g)
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SMD291SNL50T6

DigiKey Part Number
315-SMD291SNL50T6-ND
Manufacturer
Manufacturer Product Number
SMD291SNL50T6
Description
SOLDER PASTE IN JAR 50G (T6) SAC
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 1.76 oz (50g)
Datasheet
 Datasheet
Product Attributes
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Category
Flux Type
No-Clean
Manufacturer
Chip Quik Inc.
Mesh Type
6
Series
Process
Lead Free
Packaging
Bulk
Form
Jar, 1.76 oz (50g)
Part Status
Active
Shelf Life
6 Months
Type
Solder Paste
Shelf Life Start
Date of Manufacture
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
Melting Point
422 ~ 428°F (217 ~ 220°C)
Base Product Number
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
In-Stock: 5
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All prices are in EUR
Bulk
QuantityUnit PriceExt Price
1€84.95000€84.95
Manufacturers Standard Package
Unit Price without VAT:€84.95000
Unit Price with VAT:€102.78950