KEMET offers a complete portfolio of flex crack mitigation solutions that addresses most footprints, mounting techniques, flex capability and failure modes. The Fail Open technology, consisting of both “Open Mode” and “Floating Electrode” internal electrode designs, addresses the failure mode of surface mount MLCCs. They are designed to fail open, should the ceramic body be stressed and cracked. Flexible Termination technology improves the flex performance of the capacitor by directing the stress away from the ceramic body and into the termination area. Hybrid technology, the combination of fail open and flexible termination technologies, addresses both the failure mode and flex performance of the capacitor. This technology was developed for safety critical applications that require an enhanced level of protection. The most advanced and effective solution is achieved using mechanical isolation technology. Isolating the ceramic capacitor from the printed circuit board is the most effective way of protecting the ceramic component of the capacitor during mechanical or thermal stress. This technology also reduces the amount of microphonic noise that may occur when voltage is applied to the circuit, and allows for bulk capacitance configurations (capacitor stacking). All four technologies are available in both commercial and automotive grades.