The most advanced mechanical and thermal stress performance is achieved by mechanically isolating the ceramic component of the capacitor from the printed circuit board. Isolation also addresses concerns for audible, microphonic  noise that may occur when voltage is applied. As part of the Flex Mitigation portfolio, KEMET offers several mechanical isolation solutions in both commercial and automotive grades. Despite component evolution, many legacy products still exist today that offer superior flex performance over traditional surface mount devices. Through-hole radial and axial components mechanically isolate the ceramic component of the capacitor through the use of lead wire. These devices are available in a variety of dielectric materials, voltage ratings, and capacitance values and are suitable for applications that are prone to frequent mechanical stress (such as connectors that are used to interface with external devices which are frequently attached and detached). These devices offer strong mechanical bonds to the PCB and excellent thermal cycling capability when compared to traditional SMD devices. KEMET Power Solutions (KPS) devices utilize a proprietary lead-frame technology to vertically stack one or two MLCCs into a single compact surface mount package. The attached lead-frame mechanically isolates the capacitors from the printed circuit board while providing a surface mount form factor. A two chip stack offers up to double the capacitance in the same or smaller design footprint when compared to traditional surface mount MLCC devices. Capable of withstanding up to 10mm of board flex capability, all three solutions are environmentally friendly and are in compliance with RoHS legislation.