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KEMET Flex Crack Mitigation

Careful circuit board design is needed in order to avoid placing MLCC’s near areas of high flexure stress such as board edges, push connectors, and mounting holes. Another source of stress is depanelization, in which several small boards are assembled as one large unit that must then be singulated. Additionally, careful handling of boards during chip population and subsequent SMT processes is necessary in order to avoid board-flexure-related cracking.

PTM Published on: 2011-10-24
PTM Updated on: 2014-08-08