The primary failure mode of surface mount MLCC’s is low IR failures due to flex cracks. Since the inception of surface mount processing, this type of failure represents a significant portion of customer complaints and inquiries. To address this failure mode, KEMET has developed a complete line of Flex Crack Mitigation solutions that can be successfully integrated into both existing and new designs. Solutions exist to meet most capacitance, footprint, rated voltage, and mounting style needs. All solutions outlined in this presentation are readily available through DigiKey, including Flexible Termination Engineering Kits. Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive Components. For additional information regarding KEMET Flex Mitigation Solutions, please visit our flex mitigation solutions microsite at http://www.kemet.com/flex.