Industrial Case Systems: Enclosures for IoT Devices

Phoenix Contact's industrial case system (ICS) encloses OEM designs in traditional and emerging industrial applications that require control, monitoring, conditioning, regulation, conversion, and other important functionality. The integrated connectivity in this ICS includes Phoenix Contact’s standard PCB mount and through-panel connectors, as well as other standard connections such as RJ45, DSUB, USB, and antennas. This enclosure system features complete connection flexibility, completely modular in its design. The ICS product line expands to 50 mm wide variants.

Customizable heatsinks can be combined and fully integrated into the ICS 50. Passive heatsinks, as part of the ICS series, enable the finished devices to be used in thermally demanding applications. Free online thermal simulations from Phoenix Contact allow customers to optimize their PCB layouts for proper heat dissipation. If a design requires detailed analysis beyond the online simulations, additional consultation is available with comprehensive, application-specific thermal simulations and suggestions. This provides a way to identify potential long-term failures at an early stage so that appropriate steps can be taken to prevent them. This supports the move to miniaturization and dense packaging of electronics, which results in higher operating temperatures.

Until now, packaging and hardware suppliers for industrial electronics left it up to an OEM to solve these thermal management challenges in designing devices. Phoenix Contact’s ICS portfolio and online services bridge the gap and will aid OEMs in bringing their devices to market quickly and efficiently. To recap, the three elements of this ICS include integrated cooling elements (ICE)/heatsinks, free web-based thermal simulation using the online configurator, and extensive thermal simulation as a consulting service.