Advanced Thermal Solutions Inc

maxiFLOW™ with maxiGRIP™ Heatsinks

Ultra-high performance BGA cooling solutions with maxiGRIP attachment from Advanced Thermal Solutions

Image of Advanced Thermal Solutions' maxiFLOW™ with maxiGRIP™ HeatsinksAdvanced Thermal Solutions maxiFLOW design features a low-profile, spread-fin array that maximizes surface area for more effective convection (air) cooling. The maxiGRIP attachment applies steady, even pressure to the component and does not require holes in the PCB. These devices meet Telcordia GR-63-Core Office Vibration, ETSI 300 019 Transportation Vibration, and MIL-STD-810 Shock and Unpackaged Drop Testing standards. They come preassembled with high performance, phase changing, thermal interface materials.

maxiFLOW™ with maxiGRIP™ Heatsinks

AfbeeldingOnderdeelnr. fabrikantBeschrijvingAvailable QuantityPrijs
HEAT SINK 27MM X 27MM X 7.5MMATS-50270B-C1-R0HEAT SINK 27MM X 27MM X 7.5MM126 - Immediate$13.62Details weergeven
HEAT SINK 31MM X 31MM X 7.5MMATS-50310B-C1-R0HEAT SINK 31MM X 31MM X 7.5MM300 - Immediate$13.99Details weergeven
HEAT SINK 17MM X 17MM X 19.5MMATS-51170R-C1-R0HEAT SINK 17MM X 17MM X 19.5MM2559 - Immediate$15.53Details weergeven
HEAT SINK T766ATS-50450G-C3-R0HEAT SINK T766657 - Immediate$9.63Details weergeven
HEAT SINK 27MM X 27MM X 9.5MMATS-51270D-C1-R0HEAT SINK 27MM X 27MM X 9.5MM237 - Immediate$14.31Details weergeven
HEAT SINK 31MM X 31MM X 9.5MMATS-51310D-C1-R0HEAT SINK 31MM X 31MM X 9.5MM107 - Immediate$14.78Details weergeven
HEAT SINK 21MM X 21MM X 14.5MMATS-51210K-C1-R0HEAT SINK 21MM X 21MM X 14.5MM978 - Immediate$14.80Details weergeven
HEAT SINK 35MM X 35MM X 9.5MMATS-51350D-C1-R0HEAT SINK 35MM X 35MM X 9.5MM183 - Immediate$15.01Details weergeven
HEAT SINK 31MM X 31MM X 12.5MMATS-50310G-C1-R0HEAT SINK 31MM X 31MM X 12.5MM109 - Immediate$15.11Details weergeven
HEAT SINK 23MM X 23MM X 17.5MMATS-50230P-C1-R0HEAT SINK 23MM X 23MM X 17.5MM600 - Immediate$15.59Details weergeven
HEAT SINK 29MM X 29MM X 14.5MMATS-51290K-C1-R0HEAT SINK 29MM X 29MM X 14.5MM347 - Immediate$15.66Details weergeven
HEAT SINK 19MM X 19MM X 19.5MMATS-51190R-C1-R0HEAT SINK 19MM X 19MM X 19.5MM2504 - Immediate$15.78Details weergeven
HEAT SINK 31MM X 31MM X 17.5MMATS-50310P-C1-R0HEAT SINK 31MM X 31MM X 17.5MM104 - Immediate$16.32Details weergeven
HEAT SINK 35MM X 35MM X 17.5MMATS-50350P-C1-R0HEAT SINK 35MM X 35MM X 17.5MM357 - Immediate$16.63Details weergeven
HEAT SINK 27MM X 27MM X 19.5MMATS-51270R-C1-R0HEAT SINK 27MM X 27MM X 19.5MM198 - Immediate$16.72Details weergeven
HEAT SINK 35MM X 35MM X 19.5MMATS-51350R-C1-R0HEAT SINK 35MM X 35MM X 19.5MM824 - Immediate$17.49Details weergeven
HEAT SINK 29X29 X 7.5MM W/O TIMATS-50290B-C0-R0HEAT SINK 29X29 X 7.5MM W/O TIM597 - Immediate$7.64Details weergeven
MAXIGRIP HS ASSY T766 BLU-ANODIZATS-50425G-C3-R0MAXIGRIP HS ASSY T766 BLU-ANODIZ900 - Immediate$9.56Details weergeven
HEAT SINK 45X45X17.5MM T766ATS-50450P-C3-R0HEAT SINK 45X45X17.5MM T766340 - Immediate$10.42Details weergeven
HEAT SINK 31MM X 31MM X 12.5MMATS-50350P-C3-R0HEAT SINK 31MM X 31MM X 12.5MM225 - Immediate$11.19Details weergeven
Published: 2012-12-07

Related Videos

ATS Explains - Thermal Interface Material
ATS Explains - Thermal Interface Material

Publicatiedatum: 2018-01-26

Advanced Thermal Solutions - maxiGRIP
Advanced Thermal Solutions - maxiGRIP

Publicatiedatum: 2012-10-15

Related Product Highlight

Heat Sink Attachment Solutions Advanced Thermal Solutions' heat sink attachments give engineers multiple options to mechanically attach almost any heat sink to PCBs.

Related Articles and Blogs

Feasibility Study of an LED-Based Lighting System Using Analytical Modeling A study of the heat loads for an outdoor LED-based lighting system using analytical modeling to determine the feasibility of the design with solar heat load.
Device Thermal Coupling on a PCB A look at how components on a printed circuit board thermally couple and the design considerations that help minimize heat dissipation problems.
Air Flow Measurement in Electronic Systems An analysis of circuit board air flow measurement techniques and the considerations required to obtain an accurate reading in this complex environment.

Related Product Training Modules

Introduction to Heat Sinks This module will review the use of heat sinks, including how a heat sink works, the factors that impact heat sink thermal performance, common heat sink materials, and thermal interface materials.
maxiGRIP™ and Board Rework Costs maxiGrip delivers enhanced cooling and enables the user to avoid any damage to the PCB and the BGA package itself.
Phase Change - Pressure Increase maxiGRIP™ ATS maxiGRIP and superGRIP are ideal solutions when used with phase change TIM for increased thermal and mechanical performance.